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Service Offerings
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Validation Analysis
Sample Cross-Section Grinding
- Detailed description
- Assignment Steps
- Application
- Image display
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- Commodity name: Sample Cross-Section Grinding
Sample cross-section grinding refers to encapsulating the chip sample to be inspected with materials such as resin, followed by precise grinding, polishing, or even ion etching—techniques that carefully expose a specific area of the chip (e.g., failure points, solder joints, vias, gate oxide layers, etc.), revealing its internal cross-sectional view.
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Sample cutting, mounting, grinding, polishing, and observation
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Dimension Measurement
Such as film thickness, line width, via diameter, and depth, among others.
Morphological Structure
Observe the morphology, uniformity, and integrity of each material layer (metal, dielectric, silicon).
Defect Localization
Find and verify defects such as cracks, voids, delamination, electromigration, and corrosion.
Process Quality Assessment
Assess the quality of process steps such as etching, deposition, and chemical-mechanical polishing.
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