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Structural Observation
The Importance of Structural Observation
Semiconductor devices are complex, multi-layered, three-dimensional structures. Conventional electrical tests can only tell us whether a device "works" or assess its "performance," but they fail to reveal the underlying reasons why. Surface inspections, meanwhile, allow us to examine only the topmost layer. In contrast, cross-sectional analysis provides direct insights into the thickness, uniformity, and interface quality of thin films, as well as the 3D morphology of features such as transistor gates, fin-shaped field-effect transistors (FinFET) fins, and deep trenches in capacitors. It also enables the detection of internal defects—like voids, cracks, lattice imperfections, interfacial delamination, and impurity precipitates.
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