-
-
Service Offerings
-
-
-
-
Validation Analysis
Mechanical Impact Test
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
-
- Commodity name: Mechanical Impact Test
The Mechanical Shock test evaluates whether solder joints on a chip package, after being mounted onto a board (Board Level), will fracture under dynamic, intense bending—such as during manufacturing, packaging, transportation, and everyday use—which could compromise the product's lifespan. As manufacturing processes improve and products continue to shrink in size, solder joints face increasingly demanding conditions. Consequently, chip design companies have now made this test a mandatory reliability assessment requirement.
Test Conditions
Failure Mode
Mechanical impact testing is used to verify a product's ability to withstand shocks, confirming during the high-acceleration (high-G value) impact event whether the solder joints can resist external stresses. The system’s real-time monitoring allows operators to track the product’s condition throughout the test, while post-test analysis—using either red ink or cross-sectional examination—helps identify the specific areas and extent of tin cracks that have occurred.
Reference Specifications
JESD22-B110
JESD22-B111A
Category:
Tags:
Get a quote
Please note: If you're interested in our services, please leave your email to receive a free project quote. Thank you!
