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Validation Analysis
High-Temperature, High-Humidity Steady-State Testing
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: High-Temperature, High-Humidity Steady-State Testing
The Steady-state Test verifies and evaluates the resistance of encapsulating materials and internal wiring in non-sealed electronic components to moisture-induced corrosion under accelerated conditions of high temperature and high humidity. Meanwhile, the solder joints—where components are attached to the board—are subjected to additional stress from temperature, humidity, and external bias, which can accelerate metal dissociation. This leads to metal ions migrating toward the opposite electrode (a process known as electron migration or "Migration"), resulting in metal deposition and the formation of dendrites. Such phenomena may ultimately cause short circuits, significantly impacting the device's lifespan.
What JiuXi can do for you
The steady-state test, conducted under high temperature and high humidity conditions, requires a lengthy duration. We have carefully developed and established laboratory equipment (chambers) from leading brands, along with real-time monitoring channels, to help you successfully complete the relevant tests.
Reference Specifications
JESD22-A101
Applicable Fields
Consumer-grade chips, Board-level
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