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Service Offerings
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Validation Analysis
Temperature Cycle / Temperature Shock Test
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: Temperature Cycle / Temperature Shock Test
Throughout a product's lifecycle, it may encounter various temperature conditions, causing vulnerabilities to surface and leading to damage or failure—thereby compromising the product's reliability.
What JiuXi can do for you
Thermal Cycling Test: Conduct a series of high-to-low and low-to-high temperature cycles, with a temperature change rate of 5 to 15 degrees per minute.
Thermal Shock Test: This test can simulate extremely rigorous high-to-low and low-to-high temperature shock conditions, completing the customer-specified requirements within 10 seconds despite rapid temperature changes.
This test does not truly simulate real-world conditions. Its purpose is to apply severe stress and accelerate aging factors onto the item under test, thereby identifying potential factors that could lead to damage in system equipment and components, and ultimately verifying whether the product has been correctly designed or manufactured.
Common failure modes
Large differences in the thermal expansion coefficients of materials can lead to solder cracks.
Service Advantages
We have Thermal Cycling Chamber production capacity, as well as impedance monitoring equipment to provide customers with real-time monitoring.
Reference Specifications
JESD 22-A104
IPC 9701
Applicable Fields
Consumer chips, automotive Board Level
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