Package Assembly Integrity Testing

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  • Scope of application
  • Equipment Specifications
    • Commodity name: Package Assembly Integrity Testing

    Package Assembly Integrity Tests are a critical component of Reliability Analysis for automotive electronics. According to the Automotive Electronics Council (AEC) standards, these tests include Wire Bond Shear (WBS), Wire Bond Pull (WBP), Solderability (SD), Physical Dimensions (PD), Solder Ball Shear (SBS), and Lead Integrity (LI). To enter the automotive electronics supply chain, these validations must be completed during the chip packaging stage for automotive electronic components.

     

    What JiuXi can do for you

    We help ensure your products meet the AEC-Q Series standards. For automotive module manufacturers, we adhere to the ISO 16750 automotive electronics environmental testing specifications, ensuring high durability and reliability to meet the demanding requirements of the automotive industry—and helping you seamlessly enter the Tier 1 automotive supplier ecosystem.

     

    Reference Standards

    JESD22-B100

    JESD22-B105

    JESD22-B108

    AEC-Q100/AEC-Q101/AEC-Q104/AEC-Q200

    MIL-STD-883 Method 2011

     

    Application Industry

    Automotive Electronics

  • Solder Ball Shear (SBS)

    Solderability (SD)

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Long-term Analysis and Testing

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Address: Room 102, Building 3, No. 400 Fangchun Road, China (Shanghai) Pilot Free Trade Zone

Phone:021-61187200

Email:vip@jiuxilab.com

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