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Validation Analysis
Solderability Test (Solder Ball)
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: Solderability Test (Solder Ball)
For component manufacturers, once they receive complaints from end-product customers about poor soldering quality in chip packaging—such as insufficient solder wetting—they often find it difficult to determine whether the issue stems from improper soldering processes at the final assembly plant or from defective solder quality of the BGA solder balls themselves. Therefore, before shipping products, it is recommended to conduct solderability tests on chips packaged with BGA/WLCSP technologies, ensuring upfront verification of the solder ball's solderability to confirm soldering quality.
What can JiuXi do for you
It can provide the same solder paste and reflow conditions as those used by end customers, and employs an SMT simulation process to conduct solderability tests on BGA solder balls. This not only allows for precise evaluation of the soldering quality of BGA solder balls but also enables quick reproduction of failure scenarios for problematic components, facilitating defect improvement.
Common failure modes
BGA Solder Joint Failure – 3D OM Microscope Imaging BGA Solder Joint Defects - X-Ray Imaging 
Service Advantages
When it comes to verifying the soldering quality of BGA components, we not only offer a variety of printing stencils in different sizes but also provide diverse carrier boards and ceramic plates, helping you easily overcome challenges in preparing your test materials.
Reference Specifications
MIL-STD-202G
IPC J-STD-002
Applicable Fields
The field of electronic manufacturing
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