Wire Bonding Strength Test

  • Detailed description
  • Case Study Sharing
  • Scope of application
  • Equipment Specifications
    • Commodity name: Wire Bonding Strength Test

    When encapsulating a chip, metal wires are used to connect the chip and the lead frame. However, during the encapsulation process, there is a risk of insufficient strength and potential contamination. The purpose of this experiment is to verify the bonding capability by measuring the wire bond pull force and shear force, ensuring that the封装 can effectively withstand external stresses.

     

    What JiuXi can do for you

    It can be used to test aluminum wires, gold wires, and copper wires, with wire diameters as small as below 0.8 mil.

    Thrust can reach up to 200 kg; tensile force can reach up to 100 g.

     

    Service Advantages

    ★ Customized assistance for clients designing and manufacturing product fixtures

    ★ Assist customers in completing urgent requests on the same day

     

    Reference Specifications

    MIL-STD-883 Method 2011

    JESD22-B116

     

    Applicable Fields

    Integrated Circuit Packaging Process

  • Tensile Test

    Reasoning Experiment

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Phone:021-61187200

Email:vip@jiuxilab.com

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