Moisture Sensitivity Level Test (MSL Test)

  • Detailed description
  • Case Study Sharing
  • Scope of application
  • Equipment Specifications
    • Commodity name: Moisture Sensitivity Level Test (MSL Test)

    Moisture‑sensitivity and humidity‑sensitivity testing (MSL Test) is conducted to determine whether chip samples contain excessive moisture, which could lead to device failure during SMT reflow assembly—common issues include delamination, cracking, and the popcorn effect—resulting in reduced lifespan or damage.

     

    Test Procedure

    The test specimen must first undergo an “initial electrical characterization,” a “visual inspection,” and an “ultrasonic examination” to verify its initial condition—checking for delamination, cracks, or other defects—and to establish a baseline for post‑test data comparison. Subsequently, the specimen is subjected to a 24‑hour bake at 125°C, followed by moisture absorption and reflow testing. During reflow, particular care must be taken to prevent the popcorn effect (delamination or cracking).

    1. Initial electrical testing 5.3 reflow soldering test
    2. Initial Visual Inspection 6. Final Visual Inspection
    3. Initial ultrasonic inspection 7. Final ultrasonic inspection
    4. Baking/Moisture Absorption 8. Final Electrical Testing

     

    Test conditions

    The primary difference in the aforementioned process lies in the moisture‑sensitivity conditions of the components, with ratings ranging from Level 1 to Level 6.

    The test conditions differ depending on whether a leaded process (Sn-Pb eutectic assembly) or a lead-free process (Pb-free assembly) is employed, as the reflow profiles used for each vary.

     

    Failure mode

    Failure assessment encompasses visual damage and fracture, electrical test failures, internal cracking, and delamination—both in terms of location and extent. Additionally, if the selected moisture‑absorption grade fails this test, a less stringent condition may be chosen for re‑verification. The final rating must be clearly marked on the component’s outer packaging.

     

    Service Advantages

    ★ After MSL testing, proceed directly to SAT inspection, providing you with a one-stop solution.

     

    Reference Standard

    IPC/JEDEC J-STD-020

    JESD22-A113

     

    Applicable Fields

    Automotive, commercial, industrial, and consumer products

  • K3-1003N

    10 heating zones + 3 cooling zones
    Heating temperature range: 25–320°C

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