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Validation Analysis
Moisture Sensitivity Level Test (MSL Test)
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: Moisture Sensitivity Level Test (MSL Test)
Moisture-sensitive and humidity-sensitivity testing (MSL Test) is conducted to determine whether chip samples contain excessive moisture, which could lead to chip failure during SMT reflow assembly. Common issues include delamination, cracking, and the "popcorn effect," ultimately resulting in reduced lifespan or damage.
Testing Process
The item under test must first undergo "Initial Electrical Testing," "Visual Inspection," and "Ultrasonic Examination" to verify its initial condition (checking for delamination, cracks, or other defects), serving as a baseline for data comparison after testing. Following this, the item will be subjected to a 125°C "bake" for 24 hours, followed by "Moisture Absorption" and "Reflow" tests. During the Reflow process, special care must also be taken to prevent the occurrence of the "Popcorn Effect" (cracking).
1. Initial Electrical Testing 5. Three Reflow Soldering Tests
2. Initial Visual Inspection 6. Final Visual Inspection
3. Initial Ultrasonic Inspection 7. Final Ultrasonic Inspection
4. Baking/Moisture Absorption 8. Final Electrical TestingTest Conditions
The moisture sensitivity levels differ most significantly in the aforementioned process based on component moisture absorption conditions, with levels ranging from Level 1 to Level 6.
The test conditions differ depending on whether the "lead-based process (Sn-Pb Eutectic Assembly)" or the "lead-free process (Pb-Free Assembly)" is used, as they require different reflow profiles.
Failure Mode
Failure determination includes visual damage and cracking, electrical test failure, internal cracking, and delamination issues related to location and extent. Additionally, if the selected moisture absorption level fails after this test, a less stringent condition may be chosen for re-verification. The final rating must be clearly indicated on the component's outer packaging.
Service Advantages
★ After the MSL test, proceed directly to the SAT assessment—providing you with a one-stop solution.
Reference Specifications
IPC/JEDEC J-STD-020
JESD22-A113
Applicable Fields
Automotive, commercial, industrial, and consumer products
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