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Validation Analysis
Positioning and Detection (OBIRCH/INGAAS/Thermal)
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: Positioning and Detection (OBIRCH/INGAAS/Thermal)
The localization and inspection system specializes in the precise identification of failure points, hotspots, and defects, integrating two advanced analytical capabilities—OBIRCH/INGAAS infrared imaging and thermal imaging—both built on the HAMAMATSU PHEMOS 1000 platform.
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OBIRCH Localization of Leakage Points, Short-Circuit Points, and Open-Circuit Defects in Integrated Circuits
Backside OBIRCH/IR imaging after backside layer removal
Hot-Spot Detection and Thermal Distribution Imaging in the Device’s Operating State
Junction Temperature and Thermal Resistance (Rth) Analysis of Power Devices, LEDs, and RF Components
Physical Location Identification of ESD, Electrostatic Overstress (EOS), and Reliability Failures
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OBIRCH/INGAAS/Thermal
HAMAMATSU PHEMOS-1000
Equipment capabilities: 1X/5X/20X/50X/100X objectives, with a Lock‑in mode, and a four‑channel probe plus back‑focus mode.
RTH-01
Equipment capabilities: 1X/5X/10X objectives, dual-probe configuration. Features a Lock-in mode and includes two probes.
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