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Service Offerings
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Service Items
Chip circuit repair
FIB is used to physically repair internal circuitry within a chip. By leveraging FIB’s sputtering capability, interconnects can be severed at specific locations, while its deposition function enables the connection of previously unconnected segments, thereby re-routing circuit traces. This allows for the identification and diagnosis of circuit defects, with the ability to correct these errors directly on the chip, reducing R&D costs and accelerating the development process by eliminating the time and expense associated with prototype fabrication and mask modifications.
Service Items
