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Service Offerings
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Validation Analysis
ESD Testing Services
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: ESD Testing Services
E The SD test service platform supports HBM (Human Body Model), MM (Machine Model), CDM (Charged Device Model), and Latch. ‑ up Reliability Analysis for all types of electrostatic discharge and latch-up, meeting industrial-grade testing requirements from wafers to packaged devices.
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Integrated Circuit HBM / MM / CDM Electrostatic Discharge Rating Certification
Latch-Up Sensitivity Testing of Multi-Pin Chips and Complex Packages
Wafer-Level and Package-Level ESD Design Window Verification
System-level electrostatic discharge immunity testing (e.g., IEC 61000‑4‑2)
ESD Damage Reproduction and Mechanism Localization in Failure Analysis
ESD compliance verification for automotive electronics, industrial control systems, and consumer electronics.
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HBM/MM/Latch-up Test
MKII
ESD Capability: HBM = 8 kV / MM = 2 kV; Latch-up protection supported at high and room temperatures.
CDM Test
Hanwa ORION3
ESD capability: 0–30 kV.
Transmission Line Pulse (TLP) Testing
CELESTRON I
Equipment Capability:
Standard TLP:
Rise time: 2ns, 10ns，Pulse Duration: 100ps
VF-TLP:
Rise time: 200ps, Pulse Duration: 5ns
Peak pulse current: 40A
Open circuit voltage: 2000V
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