Service Items
Test Circuit Board Development and Design
From wafer fabrication to final shipment, semiconductor chips undergo multiple rounds of rigorous testing and validation. At each testing stage, different types of test boards are employed to serve as the physical and electrical interface between the chip and the automated test equipment (ATE) or environmental test chambers.
CP ( Circuit Probing ) Testing, also known as wafer testing ( Wafer Sort ) or die‑level testing is a critical process in semiconductor manufacturing, positioned between wafer fabrication and packaging. The “test board” used at this stage is commonly referred to as Probe Card It is a highly precise electromechanical interface that connects the electrical signals of the automated test equipment (ATE) to the tiny die pads on the wafer.
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