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Service Offerings
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Validation Analysis
Chip Decapsulation
- Detailed description
- Using the device
- Steps
- Application
- Image display
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- Commodity name: Chip Decapsulation
Chip chemical decapping refers to the process of selectively dissolving the external plastic/epoxy resin packaging of a chip using specific chemical reagents, thereby exposing the internal chip wafer, bonding wires, and pads—while striving to preserve the integrity of the chip's internal circuitry as much as possible.
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Laser Sealing Machine: TOPS TL-1 Plus+
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Thinning of plastic encapsulation, chemical etching, cleaning and drying, microscopic imaging
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Inspect the bonding wires:
Check whether the gold wire/copper wire is broken, corroded, or experiencing poor contact.
Inspecting the wafer chip:
Observe the silicon wafer surface for cracks, burn marks, electrostatic discharge damage, or process defects.
Check the encapsulation process:
Analyze whether the encapsulation material has quality issues such as bubbles or contamination.
Encapsulating and extracting grains:
Use a chemically etched sample encapsulation structure, leaving only the grains behind.
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