Validation Analysis
3D Surface Profile Measurer
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
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- Commodity name: 3D Surface Profile Measurer
The surface 3D profilometry analysis technique is specifically designed to address the pain points of low measurement efficiency and human error inherent in traditional methods. It delivers non-contact 3D measurement services that can rapidly scan large-area surfaces. The underlying principle involves projecting striped light patterns onto the sample’s surface; variations in the sample’s topography cause these stripes to deform. By analyzing the known incident angles, the system calculates the corresponding height differences, ultimately reconstructing a complete, detailed 3D surface profile.
What JiuXi can do for you
JiuXi provides a one-stop 3D surface profile measurement service, offering a comprehensive solution that spans from sample pre-processing and mechanical & environmental stress testing to advanced anomaly comparison and failure analysis in the later stages. If anomalies are detected after reliability testing is complete, JiuXi’s internal Failure Analysis and Material Analysis laboratories can delve deep into identifying the root causes, thereby reducing the case-handling cycle and accelerating problem resolution.
Our equipped Keyence VR-6200 3D surface profiler features automated, non-contact, high-resolution scanning capabilities, enabling simultaneous measurement of area (X/Y), height (Z), and curvature variations. With no need for complex pre-processing, it helps you accurately assess plastic deformations such as warping, expansion, and sinking, making it ideal for applications in packaging, modules, PCBs, and samples with significant height differences.
Service Advantages
High-precision + high-efficiency 3D measurement capability
The maximum measurement range reaches 300 × 150 × 70 mm, with a resolution of 0.4 μm (height) / ±5 μm (width), and features a 14-megapixel monochrome CMOS sensor. It supports high-reflective, low-reflective, and transparent samples, ensuring stable data acquisition across all types.
Balancing microstructures with large-area capabilities
Measurements can be taken from the entire module down to tiny solder balls. With a single-button, non-contact scanning process, there’s no need for manual focusing or time-consuming adjustments—plus, automatic stitching effectively minimizes human error.
Seamlessly integrate one-stop analysis to quickly pinpoint the root cause of failures.
The 3D surface profile measurement results serve as an important reference for failure analysis and material analysis, enabling rapid identification of the root cause of anomalies.
Equipment Specifications
Keyence VR-6200
Display resolution: 0.1 µm
Z-axis accuracy: Without Z stitching: ±2.5 µm / With Z stitching: ±4.0 µm
XY-axis accuracy: ±5.0 µm to ±2.0 µm
XY-axis resolution: 1 pixel = 1.9–24 µm (depends on magnification)
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Plane Surveying


3D Profile Measurement


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