Validation Analysis
Test circuit board design/fabrication
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- Commodity name: Test circuit board design/fabrication
In the complete chip manufacturing process, chip testing plays a critically important role. Whether it’s wafer-level testing (Wafer Test) conducted before die dicing or functional electrical tests performed after packaging, both steps are designed to identify and eliminate chips with electrical defects, thereby improving the overall yield of shipped products. Moreover, prior to shipment, each product must undergo an additional Reliability Analysis. By employing accelerated stress testing, manufacturers can accurately predict the product’s lifespan under real-world conditions. Additionally, short-term high-temperature aging tests help quickly screen out defective products or those prone to premature failure, preventing costly customer returns. To ensure these rigorous testing conditions and environments are met, meticulous planning of the test interface is essential at every stage of the testing process.
What JiuXi can do for you
We provide comprehensive testing projects and processes, along with expert assistance in designing test hardware, enabling customers to enjoy a one-stop shopping experience. From selecting probes, chip sockets, and high-temperature-resistant component materials, to offering PCB design, layout, fabrication, and assembly services—our offerings also include a wide range of testing services such as Burn-in Boards and Board-Level Reliability Test Boards (BLR Test Boards).
Long-standing Service Advantages
★ Providing a One-Stop Solution (Turn-key Solution)
★ Board Level Reliability: Rigorous selection of test fixtures, use of high-temperature-resistant active and passive components, and careful selection of PCB materials—all aimed at eliminating or preventing unreliable factors on the test board that could lead to incorrect test failures.
DIY Burn-in Board


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