Temperature/Humidity Testing

  • Detailed description
  • Case Study Sharing
  • Scope of application
  • Equipment Specifications
    • Commodity name: Temperature/Humidity Testing

    Products can fail, partly due to moisture. Moisture infiltrates the product by seeping through gaps in the chip encapsulant or along pin joints, causing internal metal layers within the "chip" to inadvertently connect with each other, leading to short circuits or leakage currents. The Temperature and Humidity Test is designed to evaluate the chip package's resistance to moisture, ensuring the overall reliability of the product.

     

    Test conditions

    The Temperature with Humidity (TH) test evaluates and assesses the ability of encapsulating materials and internal circuitry in non-sealed electronic components to resist moisture-induced corrosion under accelerated conditions of high temperature, high humidity, and elevated pressure. For consumer-grade components, JEDEC specifies test conditions such as THB, HAST, uHAST, and PCT.

    * Among them, HAST serves as an acceleration for THB, so you may choose either experiment.
    * As mentioned in JESD47, if HAST or THB testing is selected, the uHAST assessment will not be performed.
    * AEC requires both HAST and UHAST to be performed

     

    Failure Mode

    Place the product under test in a rigorous environment of high temperature, high humidity, and high pressure, while simultaneously applying voltage to encourage moisture to penetrate into the product through the interfaces of the encapsulant (EMC), lead frame, or substrate—allowing you to verify whether any of the following failure modes occur:

    • Interface Compatibility
    • Changes in intermetallic compounds between the bonding material and the chip or aluminum pad
    • Electrolytic corrosion leads to ion migration, which in turn causes short-circuit leakage.

    The phenomenon of ion migration leads to the deposition of dendritic metal, causing metallic regions to connect with one another.

     

    Service Advantages

    ★ We have a professional PCB manufacturing team capable of producing test boards for HAST/THB testing.

    ★ Utilizing equipment from leading industry brands for highly accurate test data

     

    Reference Standards

    JESD 47 / JESD 22-A101 / JESD 22-A110

    JESD 22-A118 / JESD 22-A102

    IEC 60068-2-66

    AEC-Q Series

     

    Application Industry

    Automotive, commercial, industrial, and consumer products

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