Validation Analysis
Temperature Cycling (TC)
- Detailed description
- Case Study Sharing
- Scope of application
- Equipment Specifications
-
- Commodity name: Temperature Cycling (TC)
Introduction
Throughout a product’s lifecycle, exposure to a wide range of temperature conditions can reveal vulnerabilities in its critical components, leading to damage or failure and ultimately compromising product reliability.
What can Jiuxi do for you?
Thermal Cycling Test: Conduct a series of high–low temperature cycling tests at a temperature change rate of 5 to 15 degrees per minute.
This test does not truly simulate real-world conditions. Its purpose is to impose severe stress and accelerate aging factors on the device under test, thereby identifying potential failure mechanisms that could affect system components and assemblies, and verifying whether the product has been properly designed or manufactured.
Service Advantages
We have thermal cycling chamber capacity and impedance monitoring equipment to enable real-time monitoring for our customers.
Reference Standard
JESD22-A104
-
Common failure modes
Schematic diagram of bending deformation caused by thermal expansion coefficient mismatch among different materials.
Fatigue Crack Initiation and Propagation in BGA Solder Joints
Hierarchical Layering of Internal Interfaces in Chips
-
Applicable Fields
Consumer chips, commercial vehicle applications
-
TCC-151W
Temperature range: -70°C to 180°C
Maximum temperature change rate range: 18°C/min
Category:
Tags:
Get a quote
Please note: If you're interested in our services, please leave your email to receive a free project quote. Thank you!
