Three-Comprehensive Test

  • Detailed description
  • Case Study Sharing
  • Scope of application
  • Equipment Specifications
    • Commodity name: Three-Comprehensive Test

    The three‑environment test simulates the complex environmental conditions that products experience during transportation and operation by subjecting them to combined temperature, humidity, and vibration stresses. It is primarily used to evaluate the adaptability and reliability of electrical and electronic products under such composite environmental exposures. This test can reveal defects that emerge under real‑world operating conditions, making it an essential step in product development, prototype testing, and quality certification. The test system employs balanced temperature‑and‑humidity control technology and is equipped with high‑precision temperature and humidity controllers and a touch‑screen interface. The equipment features a highly integrated design, offering excellent sealing and structural strength. Vibration parameters cover a frequency range of 5 Hz to 3000 Hz, supporting multiple vibration modes and multi‑axis adjustment capabilities.

     

    Test Method

    1. Sample pre‑inspection: ambient‑temperature full‑function testing, insulation resistance measurement, continuity parameter verification, and photographic documentation of the original condition.
    2. Fixture Securing: Secure the fixture to the shaker table in its actual loading orientation, and route wiring to prevent cable breakage due to vibration-induced stress.
    3. Equipment commissioning: Set the temperature–humidity cycling profile, the random vibration power spectral density, and implement continuous live‑line monitoring throughout the entire process.
    4. Temperature Field Verification: Conduct a uniformity check of the temperature within the chamber to ensure that temperature differences across all sample regions comply with the specified standards.
    5. High-Temperature, High-Humidity Phase: The temperature is raised from low to high, and the relative humidity is increased to 85%–95% RH; random vibration is applied throughout the entire cycle, allowing moisture to penetrate into the product’s interior.
    6. High-Temperature, High-Humidity Exposure: Constant high temperature and humidity, combined with continuous vibration, accelerate moisture absorption in PCBs and packages.
    7. Cooling and Condensation Section: Rapid cooling is applied while maintaining high humidity, forming a condensation film on the sample surface, with continuous vibration.
    8. Low-Temperature, Low-Humidity Conditioning: Reduce to the low-temperature range and maintain vibration; the combined effects of thermal–mechanical stress and vibrational fatigue simultaneously amplify solder joint stresses.
    9. Continuous live operation throughout the entire process, with real-time monitoring of leakage current and communication status.

  • ETH43-CCW

    Temperature range: -70°C to +180°C

    Humidity range: 25%–95% RH

    Heating/cooling rate: Max 5°C/min

     

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